XC3S1400A-4FGG484C XC3S1400A-4FGG484I XC3S1400A-4FGG676C XC3S1400A-4FTG256C XC3S1400A-5FGG484C XC3S1400AN-4FGG676I XC3S1500-4FG456C
XC3S1400A XC3S1500 XILINX Virtex FPGA ICs
XC3S1400A-4FGG484C
XC3S1400A-4FGG484I
XC3S1400A-4FGG676C
XC3S1400A-4FTG256C
XC3S1400A-5FGG484C
XC3S1400AN-4FGG676I
XC3S1500-4FG456C
XC3S1500-4FGG456C
| Categoria | Circuitos integrados (CI) |
| Família | Incorporado - FPGA (Field Programmable Gate Array) |
| Mfr | Xilinx Inc. |
| Série | XC2V6000 XC2V8000 XILINX Virtex FPGA IC |
| Pacote | Caixa |
| Parte # 1 |
XC3S1400A-4FGG484C XC3S1400A-4FGG484I XC3S1400A-4FGG676C XC3S1400A-4FTG256C XC3S1400A-5FGG484C XC3S1400AN-4FGG676I XC3S1500-4FG456C XC3S1500-4FGG456C XC2V6000-4FF1152C |
Produtos relacionados:
Estatuto do Spartan-3A FPGA
XC3S50A Produção
XC3S200A Produção
XC3S400A Produção
XC3S700A Produção
XC3S1400A Produção
XC3S50A Performance padrão VQ100/ VQG100 100 pinos Very Thin Quad Flat Pack (VQFP) C Comercial (0°C a 85°C)
TQ144/ TQG144 144-pin Thin Quad Flat Pack (TQFP) I Industrial (~40°C a 100°C) XC3S400A FT256/ FTG256 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
XC3S700A FG320/ FGG320 320-bola Fine-Pitch Ball Grid Array (FBGA)
XC3S1400A FG400/ FGG400 400-bola Fine-Pitch Ball Grid Array (FBGA)
XC3S1400A FG484/ FGG484 484 bolas de rede de bolas de pitcheiro fino (FBGA)
XC3S1400A FG676 FGG676 676 bola Fine-Pitch Ball Grid Array (FBGA)
XC3S50(2) 50K 1,728 16 12 192 12K 72K 4 2 124 56
XC3S200(2) 200K 4,320 24 20 480 30K 216K 12 4 173 76
XC3S400(2) 400K 8,064 32 28 896 56K 288K 16 4 264 116
XC3S1000(2) 1M 17.280 48 40 1.920 120K 432K 24 4 391 175
XC3S1500 1.5M 29,952 64 52 3,328 208K 576K 32 4 487 221
XC3S2000 2M 46,080 80 64 5,120 320K 720K 40 4 565 270
XC3S4000 4M 62.208 96 72 6.912 432K 1.728K 96 4 633 300
XC3S5000 5M 74.880 104 80 8.320 520K 1.872K 104 4 633 300
Para mais informações sobre a disponibilidade de estoque da família Spartan-3A FPGA,por favor, sinta-se à vontade para enviar um e-mail: sales@icschip.com

